Dr. Charles holds B.S. and Ph.D. degrees in Electrical Engineering from Drexel University and The Johns Hopkins University, respectively. He is a member of the Principal Professional Staff at The Johns Hopkins University Applied Physics Laboratory and Department Head of the Technical Services Department. Dr. Charles has worked for over 30 years in the microelectronics arena and is a specialist in solid state physics, electronic devices, packaging, and reliability. His latest interests include ultra-thin modules; advanced interconnect; biomedical instrumentation; nano-scale electronics; and alternate energy. He has published over 200 papers on electronic devices and packaging, along with thirteen patents and several pending patent applications. Dr. Charles is a Fellow and former President of IMAPS - The Microelectronics and Packaging Society, a Fellow of the IEEE, and a past member of the Board of Governors of the IEEE's Components Packaging and Manufacturing Technology (CPMT) Society. He has received international recognition for his research, development, and teaching activities, including ISHM's Technical Achievement Award (1987), selection as Maryland's Distinguished Young Engineer (1989), The Johns Hopkins University's Outstanding Teaching Award (1992), the CPMT Board of Governors' Outstanding Service Award (1992), ISHM’s Distinguished Service Award (1994), the IMAPS Daniel C. Hughes Memorial Award (1998), and numerous awards for best papers. Dr. Charles has taught for 30 years in the Johns Hopkins University Engineering Program for Professionals (JHUEPP). He has developed nine new courses and is currently chair of the Applied Physics Program in the EPP. Dr. Charles also holds the Office of Naval Research Distinguished Chair for Science and Technology at the US Naval Academy.
Materials and the interfaces between them are the key elements in determining the functioning of electronic devices and systems. This course develops the fundamental parameters of the basic solid material types and their relationships to electrical, thermal, mechanical, and optical properties. The application of these materials to the design and fabrication of electronic components is described, including integrated circuits, passive components, and electronic boards, modules, and systems.
An undergraduate degree in engineering, physics, or materials science; familiarity with materials structures and electronic devices.
To develop in the students a basic understanding of the materials used in today’s modern electronic systems so that when faced with a materials selection issue they can recognize the various materials available and perform the tradeoffs necessary to select the appropriate material for the application.
Alternate years. Typically in the Spring at the APL Cente
| HOMEWORK | 20% |
| CLASSWORK | 10% |
| MID-TERM EXAM | 35% |
| FINAL EXAM | 35% |
Sometimes a Term Paper is substituted for one of the exams.
N/A
Textbook information for this course is available online through the MBS Direct Virtual Bookstore.
There are no notes for this course.
(Last Modified: 07-22-2008 at 11:07:57 AM)