525.407 - Introduction to Electronic Packaging Course Homepage
Instructor Information
Harry Charles
Email: harry.charles@jhuapl.eduWork Phone: (443) 778-8050
Home Phone: (301) 725-6997
Dr. Charles holds B.S. and Ph.D. degrees in Electrical Engineering from Drexel University and The Johns Hopkins University, respectively. He is a member of the Principal Professional Staff at The Johns Hopkins University Applied Physics Laboratory and Department Head of the Technical Services Department. Dr. Charles has worked for over 30 years in the microelectronics arena and is a specialist in solid state physics, electronic devices, packaging, and reliability. His latest interests include ultra-thin modules; advanced interconnect; biomedical instrumentation; nano-scale electronics; and alternate energy. He has published over 200 papers on electronic devices and packaging, along with thirteen patents and several pending patent applications. Dr. Charles is a Fellow and former President of IMAPS - The Microelectronics and Packaging Society, a Fellow of the IEEE, and a past member of the Board of Governors of the IEEE's Components Packaging and Manufacturing Technology (CPMT) Society. He has received international recognition for his research, development, and teaching activities, including ISHM's Technical Achievement Award (1987), selection as Maryland's Distinguished Young Engineer (1989), The Johns Hopkins University's Outstanding Teaching Award (1992), the CPMT Board of Governors' Outstanding Service Award (1992), ISHM’s Distinguished Service Award (1994), the IMAPS Daniel C. Hughes Memorial Award (1998), and numerous awards for best papers. Dr. Charles has taught for 30 years in the Johns Hopkins University Engineering Program for Professionals (JHUEPP). He has developed nine new courses and is currently chair of the Applied Physics Program in the EPP. Dr. Charles also holds the Office of Naval Research Distinguished Chair for Science and Technology at the US Naval Academy.
Course Information
Course Description
Topics include fundamentals of electronic packaging engineering and basic concepts in thermal, mechanical, electrical, and environmental management of modern electronic systems. Emphasis is on high-frequency (and high-speed) package performance and its achievement through the use of advanced analytical tools, proper materials selection, and efficient computer- aided design. Packaging topics include die and lead attachment, substrates, hybrids, surface-mount technology, chip and board environmental protection, connectors, harnesses, and printed and embedded wiring boards.
Prerequisites
An undergraduate degree in a scientific or engineering area, including familiarity with computer-aided design and engineering analysis methods for electronic circuits and systems.
Course Goal
To have the students develop a fundamental understanding of the basic principles used in the packaging of modern electronics so that when faced with a packaging issue they can recognize the various methods available and perform the tradeoffs necessary to select the appropriate/optimum packaging solution for the applicatio
Course Objectives
- Students master fundamental knowledge of electronic packaging including package styles, hierarchy, and methods of package necessary for various environments.
- The student should be able to perform simple thermal models and make appropriate trade offs involving materials and structures to solve electronic heating problems.
- Basic understanding and application of electronic packaging models and electrical performance concepts such as impedance, loss, time delay, risetime, etc.
- The ability to distinguish between engineering performance and economic efficiency and develop cost efficient high performing packaging approaches. The student understands reliability models and the information necessary to predict the reliability of electronic components and structures.
When This Course is Typically Offered
This course typically offered Second Session Summer at APL Cente
Syllabus
Topics Covered
- INTRODUCTION
- ELECTRONIC PACKAGING CONCEPTS
- PACKAGING ECONOMICS
- PACKAGING DESIGN I
- PACKAGING DESIGN II
- SUBSTRATES
- PRINTED WIRING BOARDS
- LEVEL 1 INTERCONNECT
- LEVEL 2 INTERCONNECT
- COURSE EXAM
- LEVEL 3 INTERCONNECT
- ENVIRONMENTAL PROTECTION
- RELIABILITY
- SYSTEM PACKAGING
Student Assessment Criteria
| HOMEWORK | 20% |
| CLASSWORK | 10% |
| COURSE EXAM | 35% |
| WHITE PAPER | 35% |
Computer and Technical Requirements
N/A
Textbooks
Textbook information for this course is available online through the MBS Direct Virtual Bookstore.
Course Notes
There are no notes for this course.
(Last Modified: 07-22-2008 at 11:07:57 AM)