Course Number
525.607
Primary Program
Electrical and Computer Engineering
Mode of Study
Face to Face, Virtual Live

Topics include fundamentals of electronic packaging engineering and basic concepts in thermal, mechanical, electrical, and environmental management of modern electronic systems. Emphasis is on high-frequency (and high-speed) package performance and its achievement through the use of advanced analytical tools, proper materials selection, and efficient computer-aided design. Packaging topics include die and lead attachment, substrates, hybrids, surface-mount technology, chip and board environmental protection, connectors, harnesses, and printed and embedded wiring boards. Prerequisite(s): An undergraduate degree in a scientific or engineering area, including familiarity with computer-aided design and engineering analysis methods for electronic circuits and systems.