This course will provide students with a fundamental understanding of the principles and techniques used to design and analyze the mechanical packaging of electronics systems. Lectures will include discussions on practical approaches to the design of enclosures, including manufacturability and assembly as well as analytical approaches to thermal and structural concerns. Upon completion of this course, students will have a clear understanding of the engineering considerations and tradeoffs used in developing rugged mechanical designs for electronics systems to be used in many environments.
Course Offerings
There are no sections currently offered, however you can view a sample syllabus from a prior section of this course.