Course Number
535.638
Next Offered
Summer 2024
Primary Program
Location
Online
Course Format
Online

This course will provide students with a fundamental understanding of the principles and techniques used to design and analyze the mechanical packaging of electronics systems. Lectures will include discussions on practical approaches to the design of enclosures, including manufacturability and assembly as well as analytical approaches to thermal and structural concerns. Upon completion of this course, students will have a clear understanding of the engineering considerations and tradeoffs used in developing rugged mechanical designs for electronics systems to be used in many environments.

Course Offerings

Waitlist Only

Mechanical Packaging for Electronics Systems

535.638.81
05/28/2024 - 08/22/2024
Semester
Summer 2024
Course Format
Online
Location
Online
Cost
$5,270.00
Course Materials
Open

Mechanical Packaging for Electronics Systems

535.638.82
05/28/2024 - 08/22/2024
Semester
Summer 2024
Course Format
Online
Location
Online
Cost
$5,270.00
Course Materials
Open

Mechanical Packaging for Electronics Systems

535.638.81
08/26/2024 - 12/10/2024
Semester
Fall 2024
Course Format
Online
Location
Online
Cost
$5,270.00
Course Materials